DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey)

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DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) Price in India

Name: DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey)
Brand: DHRUVPRO
Availability: InStock

4 (15 ratings)

₹189 ₹299 36.8% OFF

₹110 cheaper than original price

▼ ₹3 cheaper than the last 6 months

Last Updated: 11 Oct 2026, 6:29 PM

Price May Drop, Wait · 58% confident

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Previous Prices

1 Year Ago

₹138

6 Months Ago

₹189

3 Months Ago

₹189

Current

₹189

Price Stats

Highest ₹199

All Time Avg ₹154

Current ₹189

Lowest Ever ₹138

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Expected move:

Our Recommendation

28

Deal Score

58%

Confidence

Near Avg

Position

Flat

6M Trend

Deal Score Breakup

Pts

Checked for price hike before sale

7
Distance from all-time low (₹138)

3
At 6 months low product price (₹189)

4
Compared with average price (₹154)

14

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) over time.

1Y → 30D → Current

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Price / Averages

Recorded Price Drops

Explore the latest price drops for DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) below.

₹10

Drop from Highest

5%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹0

30 Day Drop

0%

₹0

90 Day Drop

0%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Product Composition and Weight

The product is an ISOL 6 heat sink compound in grey color, supplied in an injection-type package weighing approximately 30 grams.

Common Applications

It is generally used as a thermal coupling for electrical and electronic devices to heat sinks, such as bases or mounting studs of transistors, diodes, and rectifiers.

Heat Transfer Function

The compound is used to maintain a positive heat-sink seal, which improves heat transfer from the device to the heat sink or chassis, increasing overall efficiency.

Electrical and Thermal Properties

It offers high thermal conductivity and low thermal resistance, and is electrically non-conductive, non-curing, non-capacitive, non-corrosive, and bleed resistant.