GENNEL G109 75g Thermal Glue, Thermal Conductive epoxy, Heatsink Adhesive

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GENNEL G109 75g Thermal Glue, Thermal Conductive epoxy, Heatsink Adhesive Price in India

Name: GENNEL G109 75g Thermal Glue, Thermal Conductive epoxy, Heatsink Adhesive
Brand: GENNEL
Availability: InStock

4.6 (32 ratings)

₹3,926 ₹18,036 78.2% OFF

₹14,110 cheaper than original price

▼ ₹684 cheaper than the last 6 months

Last Updated: 23 Sep 2026, 1:16 AM

Excellent Deal, Buy Now · 56% confident

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Previous Prices

1 Year Ago

₹4,780

6 Months Ago

₹3,503

3 Months Ago

₹5,124

Current

₹3,926

Price Stats

Highest ₹7,633

All Time Avg ₹5,153

Current ₹3,926

Lowest Ever ₹3,493

Deal Scanner

Not Buy

Good Buy Now

Expected move:

Our Recommendation

85

Deal Score

56%

Confidence

Below Avg

Position

Down

6M Trend

Deal Score Breakup

Pts

No price hike before sale

15
Distance from all-time low (₹3,493)

14
Compared with 6-month price (₹3,493)

11
Below average price (₹5,153)

45

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the GENNEL G109 75g Thermal Glue, Thermal Conductive epoxy, Heatsink Adhesive over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for GENNEL G109 75g Thermal Glue, Thermal Conductive epoxy, Heatsink Adhesive below.

₹3,707

Drop from Highest

48.6%

₹785

1 Day Drop

20%

₹0

7 Day Drop

0%

₹106

30 Day Drop

2.7%

₹919

90 Day Drop

23.4%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

75g net weight

The product contains 75 grams of thermal adhesive.

Thermal conductivity

The thermal conductivity is greater than 1.2 W/m-K, and thermal impedance is below 0.06.

Strong adhesion

The adhesive is designed to bond heatsinks to components without clips, providing strong adhesion.

High temperature resistance

The glue can withstand temperatures up to 200°C, with no melting or evaporation after 24 hours at that temperature.

Fast setting time

It sets in about 3 minutes at 25°C, according to the manufacturer.

Electrical insulation

The material has an insulation coefficient greater than 5.1 and a dissipation coefficient below 0.005.

Bond strength

The bond strength is rated at 25 kg, as stated by the seller.

Application areas

The product is suitable for MOSFET heatsinks, VGA cards, and northbridge or southbridge heatsinks.

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