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Maxtor CTG10 Thermal Compound Paste Heat Sink for IC/Processor/CPU/GPU/All Coolers, 14.5W/m.k Carbon Based High Performance, Thermal Interface Material Price in India
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Checked for price hike before sale1
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Distance from all-time low (₹1,771)10
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Compared with 6-month price (₹1,772)1
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Compared with average price (₹1,956)5
*We analyse past prices and patterns to tell you if it's truly a smart deal.
Price History
Explore the previous prices of the Maxtor CTG10 Thermal Compound Paste Heat Sink for IC/Processor/CPU/GPU/All Coolers, 14.5W/m.k Carbon Based High Performance, Thermal Interface Material over time.
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Recorded Price Drops
Explore the latest price drops for Maxtor CTG10 Thermal Compound Paste Heat Sink for IC/Processor/CPU/GPU/All Coolers, 14.5W/m.k Carbon Based High Performance, Thermal Interface Material below.
Product Features
Key Features & Specifications
Factual product details rewritten for clarity and neutral third-party description.
Carbon-Based Formula
The Maxtor CTG10 thermal paste is made of carbon micro-particles. The seller states this provides extremely high thermal conductivity and helps heat from the CPU or GPU dissipate effectively.
Thermal Conductivity Rating
The paste has a thermal conductivity of 14.5 W/m.k. The seller describes it as offering excellent component heat dissipation performance and high stability.
Easy Application
The manufacturer states the advanced materials make the silicone grease easy to apply. It is described as very easy to use even for beginners.
Safe Non-Conductive Use
The paste is metal-free and non-conductive. The seller claims this eliminates the risk of short circuits and adds protection to the CPU and VGA cards.
Five-Year Durability
According to the seller, the CTG10 does not compromise over time compared with metal and advanced silicon thermal compounds. Once applied, it is said to last at least 5 years without reapplication.
Comparison to Liquid Metal
The seller states the CTG10 offers better performance than liquid metal. This claim is based on its carbon micro-particle composition and high thermal conductivity.
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