Thermal Grizzly Minus Pad 8-30x30x1.5mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics

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Thermal Grizzly Minus Pad 8-30x30x1.5mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics Price in India

Name: Thermal Grizzly Minus Pad 8-30x30x1.5mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics
Brand: Thermal Grizzly
Availability: InStock

4.2 (119 ratings)

₹1,773 ₹1,773 0% OFF

₹0 cheaper than original price

▲ ₹975 more expensive than the last 6 months

Last Updated: 10 Oct 2026, 1:21 PM

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Previous Prices

1 Year Ago

₹499

6 Months Ago

₹799

3 Months Ago

₹799

Current

₹1,773

Price Stats

Highest ₹1,773

All Time Avg ₹771

Current ₹1,773

Lowest Ever ₹499

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53%

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Price History

Explore the previous prices of the Thermal Grizzly Minus Pad 8-30x30x1.5mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics over time.

1Y → 30D → Current

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Recorded Price Drops

Explore the latest price drops for Thermal Grizzly Minus Pad 8-30x30x1.5mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics below.

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Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Thermal Conductivity

The pad has a thermal conductivity rating of 8 W/(m·K). According to the seller, it is suitable for a range of configurations with basic to high requirements.

Device Compatibility

It is suitable for computers, laptops, PS3, PS4, PS5, Xbox 360, Xbox One, Xbox Series X, and Macbooks. The seller lists these as compatible devices.

Intended Use

The pad is designed for office, home, and gaming computers. The seller states it is for users who demand optimal performance from their equipment.

Heat Dissipation

The ceramic silicone and nano-aluminum oxide pad is said to dissipate heat by filling small gaps. The seller describes it as flexible and highly conductive.

Application Scenarios

It is used where thermal paste is not feasible, such as with a large air gap or uneven substrate. The seller provides this as a use case.

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