Thermal Paste HY204 Thermal Compound Paste Thermal Conductivity 4.0W m k Compound Silicone Grease for CPU Heatsink (100g)

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Thermal Paste HY204 Thermal Compound Paste Thermal Conductivity 4.0W m k Compound Silicone Grease for CPU Heatsink (100g) Price in India

4.5 (28 ratings)

₹6,129 ₹6,129 0% OFF

₹0 cheaper than original price

▼ ₹856 cheaper than the last 6 months

Last Updated: 19 Sep 2026, 11:43 AM

Good Deal, Worth Buying · 56% confident

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Previous Prices

1 Year Ago

₹5,042

6 Months Ago

₹7,297

3 Months Ago

₹7,325

Current

₹6,129

Price Stats

Highest ₹8,299

All Time Avg ₹6,276

Current ₹6,129

Lowest Ever ₹4,456

Deal Scanner

Not Buy

Good Buy Now

Expected move:

Our Recommendation

65

Deal Score

56%

Confidence

Below Avg

Position

Down

6M Trend

Deal Score Breakup

Pts

No price hike before sale

13
Distance from all-time low (₹4,456)

3
Compared with 6-month price (₹6,049)

10
Below average price (₹6,276)

39

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the Thermal Paste HY204 Thermal Compound Paste Thermal Conductivity 4.0W m k Compound Silicone Grease for CPU Heatsink (100g) over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for Thermal Paste HY204 Thermal Compound Paste Thermal Conductivity 4.0W m k Compound Silicone Grease for CPU Heatsink (100g) below.

₹2,170

Drop from Highest

26.1%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹306

30 Day Drop

5%

₹987

90 Day Drop

16.1%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Thermal Conductivity

The paste has a thermal conductivity of 4.0 W/m·K and is designed to transfer heat from CPU to heat sink.

Temperature Range

The manufacturer states an instantaneous temperature resistance of -50 to 340°C and a working temperature range of -50 to 200°C.

Physical Properties

The product has a specific gravity greater than 2.75 g/cm³ and a concentration of 300±10 1/10mm.

Compatible Components

The paste is suitable for PC components such as CPU, VGA, chipset, and other modules requiring high thermal conductivity.

Applications

It is intended for use in network communication equipment, notebook and desktop computers, power conversion equipment, car headlights, and control household appliances.

Package Includes

The package contains one thermal paste and one scoop.

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