UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams)

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UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) Price in India

4.5 (60 ratings)

₹4,349 ₹4,349 0% OFF

₹0 cheaper than original price

▲ ₹473 more expensive than the last 6 months

Last Updated: 11 Oct 2026, 6:17 PM

Price May Drop, Wait · 57% confident

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Previous Prices

Since May 27

₹4,102

3 Months Ago

₹4,871

Current

₹4,349

Price Stats

Highest ₹4,936

All Time Avg ₹3,876

Current ₹4,349

Lowest Ever ₹3,120

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Not Buy

Good Buy Now

Expected move:

Our Recommendation

5

Deal Score

57%

Confidence

Above Avg

Position

Up

6M Trend

Deal Score Breakup

Pts

Checked for price hike before sale

2
Distance from all-time low (₹3,120)

3
Compared with 6-month price (₹3,121)

0
Compared with average price (₹3,876)

0

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) below.

₹587

Drop from Highest

11.9%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹0

30 Day Drop

0%

₹0

90 Day Drop

0%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Not for CPU Use

The manufacturer states this thermal putty is not intended for CPU use. It is meant for GPU, VGA and memory IC chips.

High Conductivity Rating

The putty has a stated thermal conductivity of 14.8 W/mK. It is described as a replacement for soft thermal pads.

Halogen-Free Formula

The formula is halogen-free and RoHS compliant, according to the seller. It is non-conductive and said to reduce short-circuit risk.

Moldable Texture

The tacky, low-viscosity texture fits uneven surfaces. It supports auto-dispensing equipment and stencil screen-printing.

No Dry-Out Claim

The seller claims the fully cured material will not dry out over time. It is intended for assembly, rework and field repair.

Gap-Filling Design

The material compresses to fill gaps compared with rigid thermal pads. The seller describes it as practical for PC modders and repair technicians.

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