40×40mm Ptm 7950 Phase Change Thermal Conductive Sheet Set Ptm7950 Ptm 7950 Thermal Pad for Laptop Cup Gup Ssd Etc Suitable Computer Systems Machinery CPU Components Electronic Device Cooling

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40×40mm Ptm 7950 Phase Change Thermal Conductive Sheet Set Ptm7950 Ptm 7950 Thermal Pad for Laptop Cup Gup Ssd Etc Suitable Computer Systems Machinery CPU Components Electronic Device Cooling Price in India

4.5 (26 ratings)

₹619 ₹1,598 61.3% OFF

₹979 cheaper than original price

▲ ₹19 more expensive than the last 6 months

Last Updated: 13 Sep 2026, 1:29 PM

Price May Drop, Wait · 57% confident

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Previous Prices

1 Year Ago

₹499

6 Months Ago

₹599

3 Months Ago

₹699

Current

₹619

Price Stats

Highest ₹799

All Time Avg ₹562

Current ₹619

Lowest Ever ₹299

Deal Scanner

Not Buy

Good Buy Now

Expected move:

Our Recommendation

25

Deal Score

57%

Confidence

Near Avg

Position

Up

6M Trend

Deal Score Breakup

Pts

Checked for price hike before sale

6
Distance from all-time low (₹299)

0
Compared with 6-month price (₹499)

4
Compared with average price (₹562)

15

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the 40×40mm Ptm 7950 Phase Change Thermal Conductive Sheet Set Ptm7950 Ptm 7950 Thermal Pad for Laptop Cup Gup Ssd Etc Suitable Computer Systems Machinery CPU Components Electronic Device Cooling over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for 40×40mm Ptm 7950 Phase Change Thermal Conductive Sheet Set Ptm7950 Ptm 7950 Thermal Pad for Laptop Cup Gup Ssd Etc Suitable Computer Systems Machinery CPU Components Electronic Device Cooling below.

₹180

Drop from Highest

22.5%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹0

30 Day Drop

0%

₹71

90 Day Drop

11.4%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Heat Transfer

The seller describes the PTM 7950 phase change pad as providing reliable thermal conductivity between components and heatsinks.

Gap Filling

The material is said to bridge microscopic gaps when heated, which is intended to improve CPU thermal performance.

Surface Conformity

The manufacturer states the pad conforms to uneven surfaces when heated, helping it contact GPU and processor dies.

Stable Thermal Resistance

According to the seller, the sheet maintains consistent thermal resistance across varying temperatures compared to traditional thermal interface materials.

No Curing Needed

The product requires no curing time or special preparation before installation, according to the seller.

Durability

The seller claims the pad does not dry out or pump away, providing sustained thermal performance over the product lifecycle.

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