SWAPKART Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)(Pack of 2)

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SWAPKART Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)(Pack of 2) Price in India

Name: SWAPKART Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)(Pack of 2)
Brand: SWAPKART
Availability: InStock

4 (272 ratings)

₹119 ₹229 48% OFF

₹110 cheaper than original price

Last Updated: 18 Sep 2026, 3:54 PM

Good Deal, Worth Buying · 57% confident

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Previous Prices

1 Year Ago

₹179

6 Months Ago

₹179

3 Months Ago

₹119

Current

₹119

Price Stats

Highest ₹231

All Time Avg ₹202

Current ₹119

Lowest Ever ₹118

Deal Scanner

Not Buy

Good Buy Now

Expected move:

Our Recommendation

71

Deal Score

57%

Confidence

Near Low

Position

Flat

6M Trend

Near Lowest Ever

Only 0.8% above the lowest recorded price

Deal Score Breakup

Pts

Checked for price hike before sale

9
Near all-time low price (₹118)

24
Compared with 6-month price (₹118)

8
Below average price (₹202)

30

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the SWAPKART Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)(Pack of 2) over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for SWAPKART Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)(Pack of 2) below.

₹112

Drop from Highest

48.5%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹0

30 Day Drop

0%

₹0

90 Day Drop

0%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Product Specifications

This is a 2-pack of ISOL 6 heat sink compound in grey color, with injection packing type and an approximate weight of 30 g.

Thermal Coupling Use

The compound is generally used as a thermal coupling for electrical or electronic devices to heat sinks, such as base or mounting studs of transistors, diodes, and rectifiers.

Heat Transfer Improvement

It is used for maintaining a positive heat-sink seal that improves heat transfer from the component to the heat sink or chassis, thereby increasing overall efficiency.

Thermal Properties

The compound has high thermal conductivity, low thermal resistance, and is electrically non-conductive, non-curing, non-capacitive, non-corrosive, bleed resistant, and temperature resistant from -50 to 210 C.

Carbon Micro-Particles

It is composed of carbon micro-particles which lead to extremely high thermal conductivity, helping to dissipate heat from the CPU or GPU efficiently.

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