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BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs Top Drops
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BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs Price in India

4.4 (95 ratings)
₹1,782 ₹3,900 54.3% OFF
₹2,118 cheaper than original price
▼ ₹181 cheaper than the last 6 months
Last Updated: 18 Sep 2026, 4:15 PM
Good Deal, Worth Buying · 58% confident
Buy Now →
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Amazon ₹1,782 Buy →

Previous Prices

1 Year Ago
₹1,846
6 Months Ago
₹1,914
3 Months Ago
₹1,820
Current
₹1,782

Price Stats

Highest ₹2,534
All Time Avg ₹1,951
Current ₹1,782
Lowest Ever ₹1,546

Deal Scanner

Not Buy
Good Buy Now

Expected move:

Our Recommendation

67
Deal Score
58%
Confidence
Below Avg
Position
Down
6M Trend
Deal Score Breakup
Pts
  • No price hike before sale
    14
  • Distance from all-time low (₹1,546)
    10
  • Compared with 6-month price (₹1,590)
    9
  • Below average price (₹1,951)
    34

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs below.

₹752
Drop from Highest
29.7%
₹535
1 Day Drop
30%
₹1,426
7 Day Drop
80%
₹71
30 Day Drop
4%
₹37
90 Day Drop
2.1%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

High Thermal Conductivity

The seller states this heatsink plaster offers high thermal conductivity, low leakage, and high temperature stability.

Wide Application Range

It is intended for 3D printer heatsinks, CPUs, LEDs, ICs, GPU chipsets, PC heatsinks, and other electronic components that need firm bonding.

Adhesive Properties

According to the seller, the adhesive is odorless, non-toxic, moisture-proof, non-swelling, and non-corrosive to substrates.

Fast Curing Time

The product is said to solidify quickly after exposure to air, with a stated dry time of 5 to 15 minutes at 25°C.

Thermal Specifications

Stated heat transfer coefficient is over 0.975 W/m-k and thermal impedance is under 0.246 c-in/W.

Bonding Strength

The manufacturer lists bonding strength at 1.8 MPa and arc resistance at 120 seconds.

Application Thickness

The recommended application thickness is 0.1 to 0.5 mm, with thinner layers stated as better.

Surface Preparation

The seller advises cleaning the bonded surface, such as with alcohol, before applying the product.

Package Contents

Each pack includes three tubes of thermal glue.

After-Sales Guarantee

The seller states that defective items can be replaced for free or refunded, and offers customer support for questions.

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