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Home› Deals› Computers & Accessories› Thermal Paste & Pads› BSFF Thermal Paste 11g CPU Paste for CPU, GPU, IC Processor Heatsink
BSFF Thermal Paste 11g CPU Paste for CPU, GPU, IC Processor Heatsink Top Drops
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BSFF Thermal Paste 11g CPU Paste for CPU, GPU, IC Processor Heatsink Price in India

4.7 (9327 ratings)
₹1,520 ₹2,432 37.5% OFF
₹912 cheaper than original price
▼ ₹941 cheaper than the last 6 months
Last Updated: 12 Oct 2026, 7:00 AM
Good Deal, Worth Buying · 55% confident
Buy Now →
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Amazon ₹1,520 Buy →

Previous Prices

1 Year Ago
₹999
6 Months Ago
₹3,440
3 Months Ago
₹1,730
Current
₹1,520

Price Stats

Highest ₹3,960
All Time Avg ₹2,692
Current ₹1,520
Lowest Ever ₹899

Deal Scanner

Not Buy
Good Buy Now

Expected move:

Our Recommendation

68
Deal Score
55%
Confidence
Below Avg
Position
Flat
6M Trend
Deal Score Breakup
Pts
  • No price hike before sale
    14
  • Distance from all-time low (₹899)
    0
  • Compared with 6-month price (₹1,511)
    11
  • Below average price (₹2,692)
    43

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Compare All Product Variations

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Compare sizes, colors, live prices, savings, seller, stock, and delivery across all available variations of BSFF Thermal Paste 11g CPU Paste for CPU, GPU, IC Processor Heatsink.

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Price History

Explore the previous prices of the BSFF Thermal Paste 11g CPU Paste for CPU, GPU, IC Processor Heatsink over time.

1Y → 30D → Current

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Price / Averages

Recorded Price Drops

Explore the latest price drops for BSFF Thermal Paste 11g CPU Paste for CPU, GPU, IC Processor Heatsink below.

₹2,439
Drop from Highest
61.6%
₹0
1 Day Drop
0%
₹0
7 Day Drop
0%
₹0
30 Day Drop
0%
₹192
90 Day Drop
12.6%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Non-Conductive Formula

The manufacturer states the paste is metal-free and non-conductive, which reduces the risk of short circuits and protects CPU and VGA cards.

Carbon Microparticles

The seller claims the carbon microparticle formula provides high thermal conductivity and faster heat dissipation than liquid metal for CPUs and GPUs.

Stable Heat Management

According to the brand, the advanced formula supports reliable heat management and stable system performance even under high loads.

Long-Term Performance

The seller says the paste retains its performance over time, unlike metal- or silicone-based thermal adhesives, when used correctly.

Even Application

The paste has a consistency that allows even, clean spreading, and the included toolkit supports precise application for beginners and experienced users.

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