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Home Thermal Paste & Pads DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey)
DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) Hot Deal
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DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) Price in India

4 (15 ratings)
₹189 ₹249 24.1% OFF
₹60 cheaper than original price
▼ ₹3 cheaper than the last 6 months
Last Updated: 18 Sep 2026, 3:22 AM
High Price, Consider Waiting · 58% confident
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Amazon ₹189 Buy →

Previous Prices

1 Year Ago
₹138
6 Months Ago
₹189
3 Months Ago
₹189
Current
₹189

Price Stats

Highest ₹199
All Time Avg ₹154
Current ₹189
Lowest Ever ₹138

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Expected move:

Our Recommendation

38
Deal Score
58%
Confidence
Near Avg
Position
Up
6M Trend
Deal Score Breakup
Pts
  • Checked for price hike before sale
    9
  • Distance from all-time low (₹138)
    3
  • At 6 months low product price (₹189)
    5
  • Compared with average price (₹154)
    21

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) over time.

1Y → 30D → Current

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Price / Averages

Recorded Price Drops

Explore the latest price drops for DHRUVPRO 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) below.

₹10
Drop from Highest
5%
₹0
1 Day Drop
0%
₹0
7 Day Drop
0%
₹0
30 Day Drop
0%
₹0
90 Day Drop
0%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Product Composition and Weight

The product is an ISOL 6 heat sink compound in grey color, supplied in an injection-type package weighing approximately 30 grams.

Common Applications

It is generally used as a thermal coupling for electrical and electronic devices to heat sinks, such as bases or mounting studs of transistors, diodes, and rectifiers.

Heat Transfer Function

The compound is used to maintain a positive heat-sink seal, which improves heat transfer from the device to the heat sink or chassis, increasing overall efficiency.

Electrical and Thermal Properties

It offers high thermal conductivity and low thermal resistance, and is electrically non-conductive, non-curing, non-capacitive, non-corrosive, and bleed resistant.

Temperature Resistance Range

The material is temperature resistant from -50 to 210 degrees Celsius.

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