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Ranz Syringe Thermal Grease Paste, CPU Paste, Heat Sink Compound for CPU and Chipset (Gray/30 Grams Approx) Price in India
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Matches recorded low (limited range) (₹199)25
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Product Features
Key Features & Specifications
Factual product details rewritten for clarity and neutral third-party description.
Thermal Compound Function
This is a thermal paste intended to help keep the processor cool. It is used as an interface between heat sinks and heat sources.
Thermal Conductivity
The thermal conductivity is rated at greater than 1.93 W/m-K. The thermal impedance is listed as less than 0.225 C in2/W.
Long-Term Stability
The seller states that due to the low thermal impedance, the grease condition is maintained for a long time.
Usage
It is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role is to eliminate air gaps to maximize heat transfer.
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