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Home Thermal Paste & Pads Sadow Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (30g) (Pack of...
Sadow Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (30g) (Pack of 2) Lowest Ever
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Sadow Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (30g) (Pack of 2) Price in India

4.2 (3 ratings)
₹229 ₹999 77.1% OFF
₹770 cheaper than original price
Last Updated: 15 Sep 2026, 3:57 AM
Average Price, Buy If Needed · 60% confident
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Previous Prices

1 Year Ago
₹229
6 Months Ago
₹229
3 Months Ago
₹229
Current
₹229

Price Stats

Highest ₹229
All Time Avg ₹229
Current ₹229
Lowest Ever ₹229

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Our Recommendation

55
Deal Score
60%
Confidence
Near Avg
Position
Flat
6M Trend
Deal Score Breakup
Pts
  • Checked for price hike before sale
    5
  • Matches recorded low (limited range) (₹229)
    25
  • Compared with recent price level (₹229)
    6
  • Compared with average price (₹229)
    19

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the Sadow Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (30g) (Pack of 2) over time.

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Price / Averages

Recorded Price Drops

Explore the latest price drops for Sadow Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (30g) (Pack of 2) below.

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Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Material and Packing

The compound is made from ISOL 6 heat sink material and comes in grey. Each tube contains approximately 30 grams and is packaged as an injection-style syringe.

Carbon Micro-Particles

The paste is composed of carbon micro-particles that the seller states lead to extremely high thermal conductivity. According to the seller, this helps heat from the CPU or GPU dissipate efficiently.

Non-Conductive Formula

The heat sink paste is metal-free and non-electrically conductive. The seller claims this removes the risk of short circuits and adds protection for the CPU and VGA cards.

Typical Applications

The paste is generally used as a thermal coupling between electrical or electronic devices and heat sinks. Common uses include the base or mounting studs of transistors, diodes, and rectifiers.

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