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Sadow Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (30g) (Pack of 1) Price in India
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Product Features
Key Features & Specifications
Factual product details rewritten for clarity and neutral third-party description.
Material and Weight
The product is an ISOL 6 heat sink compound in grey color, supplied in an injection-type pack weighing approximately 30g.
Carbon Micro-Particles
The seller states the compound contains carbon micro-particles that provide extremely high thermal conductivity, helping dissipate heat from CPUs or GPUs efficiently.
Non-Conductive and Metal-Free
According to the seller, the paste is metal-free and non-electrically conductive, which eliminates risks of short circuits and adds protection to CPUs and VGA cards.
Typical Applications
The paste is generally used as a thermal coupling for electrical or electronic devices to heat sinks, such as transistor bases, diodes, and rectifiers.
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