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Thermalright TF8 1.2g Thermal Compound Paste Heatsink Paste Carbon Based High Performance Thermal Compound CPU for All Coolers, Thermal Interface Material High Durability 13.8W/m.k, 1.2 Grams Price in India
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Expected move:
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No price hike before sale15
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At all-time low price (₹681)25
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At 6 months low product price (₹682)10
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Below average price (₹1,246)42
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Price History
Explore the previous prices of the Thermalright TF8 1.2g Thermal Compound Paste Heatsink Paste Carbon Based High Performance Thermal Compound CPU for All Coolers, Thermal Interface Material High Durability 13.8W/m.k, 1.2 Grams over time.
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Recorded Price Drops
Explore the latest price drops for Thermalright TF8 1.2g Thermal Compound Paste Heatsink Paste Carbon Based High Performance Thermal Compound CPU for All Coolers, Thermal Interface Material High Durability 13.8W/m.k, 1.2 Grams below.
Product Features
Key Features & Specifications
Factual product details rewritten for clarity and neutral third-party description.
Thermal Conductivity
The seller states the thermal compound has a thermal conductivity of 13.8 W/m.k.
Material Safety
The manufacturer states the paste contains no metal particles and no oil-based solvents. It is described as non-conductive, non-corrosive, and harmless to CPU and GPU components.
Durability
According to the seller, the silicone grease has a long service life and low volatility. It is intended to maintain thermal conductivity over time in CPUs, GPUs, and other electronic components.
Temperature Stability
The manufacturer lists a usable temperature range of -220C to +380C. The thermal resistance is stated as less than 0.01 and density as 2.9 at 25C.
Easy Application
The needle-type design is intended for convenient application and storage. A spatula is included, and the moderate viscosity is described as easy to spread for beginners.
Package Contents
The package includes one thermal paste and one scraper. The product weight is 1.2g.
Thermal Interface Function
The product is intended to fill the gap between a CPU and a heat sink to conduct heat away from the processor.
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