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Home Thermal Paste & Pads Thermal Grizzly Minus Pad 8-30x30x0.5mm Thermal Interface Pad
Thermal Grizzly Minus Pad 8-30x30x0.5mm Thermal Interface Pad Top Drops
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Thermal Grizzly Minus Pad 8-30x30x0.5mm Thermal Interface Pad Price in India

4.1 (74 ratings)
₹1,551 ₹1,551 0% OFF
₹0 cheaper than original price
▼ ₹583 cheaper than the last 6 months
Last Updated: 18 Sep 2026, 3:26 AM
Good Deal, Worth Buying · 52% confident
Buy Now →
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Previous Prices

1 Year Ago
₹899
6 Months Ago
₹1,970
3 Months Ago
₹2,141
Current
₹1,551

Price Stats

Highest ₹3,211
All Time Avg ₹1,603
Current ₹1,551
Lowest Ever ₹699

Deal Scanner

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Good Buy Now

Expected move:

Our Recommendation

69
Deal Score
52%
Confidence
Below Avg
Position
Up
6M Trend
Deal Score Breakup
Pts
  • No price hike before sale
    13
  • Distance from all-time low (₹699)
    0
  • At 6 months low product price (₹1,551)
    11
  • Below average price (₹1,603)
    45

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the Thermal Grizzly Minus Pad 8-30x30x0.5mm Thermal Interface Pad over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for Thermal Grizzly Minus Pad 8-30x30x0.5mm Thermal Interface Pad below.

₹1,660
Drop from Highest
51.7%
₹0
1 Day Drop
0%
₹315
7 Day Drop
20.3%
₹318
30 Day Drop
20.5%
₹428
90 Day Drop
27.6%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Wide Device Compatibility

The manufacturer states it works with computers, laptops, PS3, PS4, PS5, Xbox 360, Xbox One, Xbox Series X, and MacBooks.

Home and Gaming Use

Said to be intended for office and home computers, gaming computers, and users who require high equipment turnover.

Ceramic Silicone Composition

The seller describes its unique composition of ceramic silicone and nano-aluminum oxide as dissipating significant amounts of heat.

Flexible and Conductive

The pad is described as having a flexible structure and very high heat conductivity to compensate for small gaps between components.

Paste-Free Applications

Used where thermal paste cannot be applied, such as large air gaps or uneven substrates.

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