Thermalright TF8 2g High Performance Thermal Paste 12.8W/m.k-2 Grams

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Thermalright TF8 2g High Performance Thermal Paste 12.8W/m.k-2 Grams Price in India

Name: Thermalright TF8 2g High Performance Thermal Paste 12.8W/m.k-2 Grams
Brand: Thermalright
Availability: InStock

4.6 (50 ratings)

₹1,237 ₹2,408 48.6% OFF

₹1,171 cheaper than original price

▼ ₹4 cheaper than the last 6 months

Last Updated: 31 Aug 2026, 7:49 AM

Average Price, Buy If Needed · 35% confident

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Price Stats

Highest ₹2,408

All Time Avg ₹1,237

Current ₹1,237

Lowest Ever ₹1,100

Deal Scanner

Not Buy

Good Buy Now

Expected move:

Our Recommendation

48

Deal Score

35%

Confidence

Near Avg

Position

Flat

6M Trend

Deal Score Breakup

Pts

Checked for price hike before sale

9
Distance from all-time low (₹1,100)

14
At 6 months low product price (₹1,242)

5
Compared with average price (₹1,237)

20

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the Thermalright TF8 2g High Performance Thermal Paste 12.8W/m.k-2 Grams over time.

1Y → 30D → Current

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Price / Averages

Recorded Price Drops

Explore the latest price drops for Thermalright TF8 2g High Performance Thermal Paste 12.8W/m.k-2 Grams below.

₹1,170

Drop from Highest

48.6%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹0

30 Day Drop

0%

₹0

90 Day Drop

0%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Thermal Conductivity

The paste has a thermal conductivity rating of 12.8 W/m·K, according to the manufacturer.

Thermal Resistance

The thermal resistance is less than 0.01 °C/W, as stated by the seller.

Temperature Range

It operates in temperatures from -50°C to 240°C.

Electrical Safety

The material is non-conductive and non-harmful, according to the manufacturer.

Non-Silicone Formula

The manufacturer states that the paste contains no silicone oil or additives, which helps maintain consistent thermal conductivity over long-term use.

Application Advantage

The paste is intended to fill gaps between the CPU and heat sink to conduct heat and help prevent damage from poor heat dissipation, potentially prolonging component life.

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