TRUEBOND Heatsink Thermal Conductive Silicone Pad Size (100 x 100) 6.0 W/(m⋅K) Thermal Conductivity, Soft Safe Simple to Apply for SSD CPU GPU LED IC (3.5 MM)

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TRUEBOND Heatsink Thermal Conductive Silicone Pad Size (100 x 100) 6.0 W/(m⋅K) Thermal Conductivity, Soft Safe Simple to Apply for SSD CPU GPU LED IC (3.5 MM) Price in India

Name: TRUEBOND Heatsink Thermal Conductive Silicone Pad Size (100 x 100) 6.0 W/(m⋅K) Thermal Conductivity, Soft Safe Simple to Apply for SSD CPU GPU LED IC (3.5 MM)
Brand: TRUEBOND
Availability: InStock

5 (1 ratings)

₹1,194 ₹1,999 40.3% OFF

₹805 cheaper than original price

▼ ₹1 cheaper than the last 6 months

Last Updated: 31 Aug 2026, 7:48 AM

Average Price, Buy If Needed · 35% confident

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Price Stats

Highest ₹1,195

All Time Avg ₹1,194

Current ₹1,194

Lowest Ever ₹1,194

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Expected move:

Our Recommendation

55

Deal Score

35%

Confidence

Near Avg

Position

Flat

6M Trend

Deal Score Breakup

Pts

No price hike before sale

13
Matches recorded low (limited range) (₹1,194)

25
Compared with recent price level (₹1,195)

6
Compared with average price (₹1,194)

11

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the TRUEBOND Heatsink Thermal Conductive Silicone Pad Size (100 x 100) 6.0 W/(m⋅K) Thermal Conductivity, Soft Safe Simple to Apply for SSD CPU GPU LED IC (3.5 MM) over time.

1Y → 30D → Current

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Price / Averages

Recorded Price Drops

Explore the latest price drops for TRUEBOND Heatsink Thermal Conductive Silicone Pad Size (100 x 100) 6.0 W/(m⋅K) Thermal Conductivity, Soft Safe Simple to Apply for SSD CPU GPU LED IC (3.5 MM) below.

₹1

Drop from Highest

0.1%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹0

30 Day Drop

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₹0

90 Day Drop

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Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Material and Conductivity

The pad is made of silicone and has a thermal conductivity rated at 6.0 W/(m·K), facilitating heat transfer between components and heatsinks.

Size and Thickness

Each pad measures 100 x 100 mm and is 3.5 mm thick, designed to fill gaps between heat-generating parts and cooling solutions.

CPU and GPU Cooling

Commonly used with processors and graphics cards to move heat to the heatsink, helping maintain efficient operation.

Laptop Component Use

Applied to laptop CPUs, GPUs, and VRMs to conduct heat away into the cooling system.

RAM Modules

Helps dissipate heat from high-performance RAM modules to the chassis or heat spreaders.

SSD Heat Dissipation

Can be placed on SSDs to aid heat dissipation during heavy read/write tasks, reducing the chance of thermal throttling.

Consumer Electronics

Used in devices like smartphones, tablets, and gaming consoles to manage internal heat and preserve performance.

BMS Thermal Contact

Improves thermal contact between battery cells and a Battery Management System, which may enhance temperature monitoring efficiency.

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