UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams)

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UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) Price in India

4.5 (56 ratings)

₹3,365 ₹3,365 0% OFF

₹0 cheaper than original price

▼ ₹554 cheaper than the last 6 months

Last Updated: 18 Sep 2026, 3:10 AM

Good Deal, Worth Buying · 57% confident

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Previous Prices

Since May 27

₹4,102

3 Months Ago

₹4,078

Current

₹3,365

Price Stats

Highest ₹4,936

All Time Avg ₹3,920

Current ₹3,365

Lowest Ever ₹3,120

Deal Scanner

Not Buy

Good Buy Now

Expected move:

Our Recommendation

71

Deal Score

57%

Confidence

Below Avg

Position

Down

6M Trend

Deal Score Breakup

Pts

No price hike before sale

12
Distance from all-time low (₹3,120)

18
Compared with 6-month price (₹3,121)

8
Below average price (₹3,920)

33

*We analyse past prices and patterns to tell you if it's truly a smart deal.

Price History

Explore the previous prices of the UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) over time.

1Y → 30D → Current

No price history data yet

Price / Averages

Recorded Price Drops

Explore the latest price drops for UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) below.

₹1,571

Drop from Highest

31.8%

₹0

1 Day Drop

0%

₹0

7 Day Drop

0%

₹0

30 Day Drop

0%

₹589

90 Day Drop

17.5%

Product Features

Key Features & Specifications

Factual product details rewritten for clarity and neutral third-party description.

Not for CPU Use

The manufacturer states this thermal putty is not intended for CPU use. It is meant for GPU, VGA and memory IC chips.

High Conductivity Rating

The putty has a stated thermal conductivity of 14.8 W/mK. It is described as a replacement for soft thermal pads.

Halogen-Free Formula

The formula is halogen-free and RoHS compliant, according to the seller. It is non-conductive and said to reduce short-circuit risk.

Moldable Texture

The tacky, low-viscosity texture fits uneven surfaces. It supports auto-dispensing equipment and stencil screen-printing.

No Dry-Out Claim

The seller claims the fully cured material will not dry out over time. It is intended for assembly, rework and field repair.

Gap-Filling Design

The material compresses to fill gaps compared with rigid thermal pads. The seller describes it as practical for PC modders and repair technicians.

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